TEC1-12710 Semiconductor thermoelectric cooler 

Part number: TEC1-12710
Dimension: 40 * 40,mm components logarithmic:  127 * 3.4 
Wire specifications: 300 + 8 mm long RV lead wire single head 5 mm tin plating
Internal resistance value: 1.2 ~ 1.3 Ω (23 + / - 1 ℃, environment temperature 1 KHZ Ac test)
Maximum temperature difference: delta Tmax (Qc = 0) above 60 ℃.
Working current: Imax = 10 a (maximum voltage startup)
Rated voltage: DC12V (maximum voltage: 15.5 V)
Cooling power: 100 w Qcmax
The assembly pressure: 85 n/cm2
Working conditions: temperature range and 55 ℃ ~ 83 ℃ (high environmental temperature will directly affect the cooling efficiency)
Encapsulation process: standard around 704 silicone rubber seal
Packing: bubble box packing, storing conditions - 10 ℃ to 40 ℃ ambient temperature
Storage conditions: - 40 ~ 60 ℃ the chip: TEC1-12710
Dimension: 40 * 40 127 * 3.4 mm components logarithmic
Wire specifications: 300 + 8 mm long RV lead wire single head 5 mm tin plating
Internal resistance value: 1.2 ~ 1.3 Ω (23 + / - 1 ℃, environment temperature 1 KHZ Ac test)
Maximum temperature difference: delta Tmax (Qc = 0) above 60 ℃.
Working current: Imax = 10 a (maximum voltage startup)
Rated voltage: DC12V (maximum voltage: 15.5 V)
Cooling power: 100 w Qcmax
The assembly pressure: 85 n/cm2
Working conditions: temperature range and 55 ℃ ~ 83 ℃ (high environmental temperature will directly affect the cooling efficiency)
Encapsulation process: standard around 704 silicone rubber seal
Packing: bubble box packing, storing conditions - 10 ℃ to 40 ℃ ambient temperature
Storage conditions: - 40 ~ 60 ℃

Side with words is the cooling surface
No words on side is the radiating surface